Automatic Nozzle Change High Precision IC Bonding Machine WBD2200 PLUS 8-12 Inch Wafers

General type high-precision IC bonder, which is suitable for mass wafer loading products, SIP packaging, Memory Stack Die (memory stack), CMOS, MEMS and other processes.

Features:

• Multilayer capability
• Automatic nozzle change
• Supermini chip placement
• Compatible with 8-12 inch wafers
• Ultrathin die bonding technology
• Bottom photo-taking, high precision placement
• Automatic loading and unloading
• Automatic wafer change

Main application:

It is suitable for mass wafer loading products, and for SIP packaging, Memory Stack Die (memory stack), CMOS, MEMS and other processes. It is mainly used in automotive electronics, medical electronics, optoelectronics, mobile phones and other industries.

Product advantage:

High precision Accuracy :±15μm@3σ Angle: Die size: > 1 x 1 mm ±0.3°@3σ Die size: < 1 x 1 mm ±1°@3σ
Material box loading Fully automatic feeding and discharging Warehouse processing system, supported by SMEMA online communication agreement,support the SECS/GEM protocol
Stacking loading Multiple feeding methods, compatible with stacking feeding function, improving customer selectivity
Nozzle station Equipped with a fully automatic wafer loading and unloading processing system, support to the SECS/GEM protocol
Visual recognition 2448x2048 resolution 256 gray levels Support gray value template, custom shape template The platform can be positioned twice The angle error is ±0.01deg
Real-time compensation It can detect the image after bonding and do automatic real-time compensation to ensure stable mounting accuracy

Product Parameters:

Notices:

1.Leakage protection switch: ≥100ma

2.Compressed air requirement: 0.4-0.6Mpa

Inlet pipe specification: Ø10mm

3.Vacuum requirement:<-88kPa

Inlet pipe specification: Ø10mm

Tracheal joint: 2 pieces

4.Power requirements:

①Voltage: AC220V, frequency 50/60HZ;

②Wire requirements: Three core power copper wire, wire diameter≥2.5mm², leakage protection switch 50A, leakage protection switch leakage≥100mA.

5.The ground is required to withstand a pressure of 800kg/m²

Founded in Hong Kong in 1984, Suneast technology established its industrial park in Shenzhen in 1999 and listed on the main board of Hong Kong stock exchange in 2000 (Stock Code: 0365. HK).The independent R&D products, like reflow oven, wave soldering machine, selective soldering machine, vertical oven, printer and etc has always maintained a leading position in technology, and provided professional electronic equipment solutions for many well-known enterprises at home and abroad.

With modern industrial parks and advanced R&D facilities, Suneast technology has strong system integration capabilities in R&D, design, production, automation and information equipment manufacturing. Its sales network is all over the world. Suneast technology has been achieved technical strategic cooperation with Tsinghua University, Chinese University of Hong Kong, Hong Kong University of Science and Technology and Harbin Institute of Technology, and its R&D capabilities has reached the advanced level at home and abroad.

In the core area of Guangdong-Hong Kong-Macao Greater Bay Area, Suneast technology has served semiconductor back-end application customers for more than 40 years, its downstream and end customers include Huawei, ZTE, TCL, Hikvision, MLS LIGHTING, DBG, DESAYSV AUTOMOTIVE, SHENZHEN MTC, JFLED, etc.

The dual drive gantry synchronous follow linear motor technology has been successfully applied to a number of high-speed and high-precision equipment manufacturing and processing fields, and gains great praise by users. The new semiconductor packaging equipment, like chip bonder is the masterpiece of Suneast technology, which helps the development of domestic chip industry. Today, Suneast technology has become the leader of China's intelligent equipment industry.

As the core enterprise of Sino ICT Holdings, Suneast technology will strengthen the strategic goal of the group and become a world-class enterprise in the field of high technology.

Culture

Vision

To be the leader in the global SMT intelligent equipment industry and the champion in the semiconductor equipment sub-industry!

Maintain leading technology level, R&D strength, industrial scale, and management model, and become the leader of the global SMT intelligent equipment industry and the champion of the semiconductor equipment sub-industry!

  Mission