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High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine

Suneast Intelligent Equipment Technology (Shenzhen) Co.Ltd
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    Buy cheap High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine from wholesalers
     
    Buy cheap High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine from wholesalers
    • Buy cheap High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine from wholesalers
    • Buy cheap High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine from wholesalers

    High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine

    Ask Lasest Price
    Brand Name : Suneast
    Model Number : CBD2200 EVO
    Certification : CE、ISO
    Price : Negotiable
    Payment Terms : T/T,
    Delivery Time : 25~50 days
    • Product Details
    • Company Profile

    High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine

    Productive High Speed Small footprint IC Bonder CBD2200 EVO Modular Platform Design


    Features:

    • High speed, accurate solidification capacity ±10um@3σ;
    • High production efficiency, low cost input
    • High multi-chip processing capacity, support 16 different types of chip placement
    • High flexibility to support multiple carrier operations
    • Can work in different plane heights, support deep cavity work
    • Modular platform design, small appearance, small footprint

    Product advantage:

    High precision

    Accuracy: ±10μm@3σ

    Angle: ±0.15°@3σ

    High precision linear motor

    Waffle pack / Gel-Pak

    Supports 16 Waffle packs (2 "x 2")

    4”x 4”size is available.

    Automatic height measurement

    Accuracy: 3μm

    Supports a variety of probes

    Can be replaced with laser

    altimeter according to demand

    Nozzle station

    Quick automatic nozzle change

    Supports 7 nozzle stations.

    Visual recognition

    2448x2048 resolution

    256 gray level

    Support gray value template,

    custom shape template

    The platform can be positioned twice.

    The Angle error is ±0.01deg.

    Deep cavity operation

    Work at different plat heights.

    The maximum depth is 11mm.


    Features of dispensing function:

    • Supports various types of epoxy adhesives
    • Meet various graphic dispensing needs
    • Comes with commonly used standard graphics library
    • Support custom graphics library

    Product parameters:

    ItemSpecification
    Placement accuracy≤±10um@3σ
    Placement angle accuracy±0.15°@3σ
    Force control range20~1000g(with different configurations, the maximum support is 7500g)
    Force control accuracy20g-150g:± 2g@3σ 150g-1000g:±5%@3σ
    Substrate pallet size(mm)L200 X W90~150
    Tray size(mm)Based on customer products
    Loading/UnloadingManual / auto
    IC dimension(mm)L0.25X W0.25—L10 X W10
    IC supplyWaffle tray
    Core module movement modeLinear motor + grating scale
    Glue feeding modeDispensing + painting glue
    Auto change nozzleSeven
    Bottom photo-takingEquipped with camera
    Machine dimension(mm)L(1400)*W(1250)*H(1700)
    WeightNet weight of equipment:Approx.1500Kg

    Notices:

    1.Leakage protection switch: ≥100ma

    2.Compressed air requirement: 0.4-0.6Mpa

    Inlet pipe specification: Ø10mm

    3.Vacuum requirement:<-88kPa

    Inlet pipe specification: Ø10mm

    Tracheal joint: 2 pieces

    4.Power requirements:

    ①Voltage: AC220V, frequency 50/60HZ

    ②Wire requirements: Three core power copper wire, wire diameter≥2.5mm², leakage protection switch 50A, leakage protection switch leakage≥100mA

    5.The ground is required to withstand a pressure of 800kg/m².

    Quality High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine for sale
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