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Gold / Silver Paste Printer Machine Fully Automatic Semiconductor Printer

Suneast Intelligent Equipment Technology (Shenzhen) Co.Ltd
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    Buy cheap Gold / Silver Paste Printer Machine Fully Automatic Semiconductor Printer from wholesalers
     
    Buy cheap Gold / Silver Paste Printer Machine Fully Automatic Semiconductor Printer from wholesalers
    • Buy cheap Gold / Silver Paste Printer Machine Fully Automatic Semiconductor Printer from wholesalers

    Gold / Silver Paste Printer Machine Fully Automatic Semiconductor Printer

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    Brand Name : Suneast
    Model Number : SEMI-E3
    Certification : CE、ISO
    Price : Negotiable
    Payment Terms : T/T
    Delivery Time : 25~50 days
    • Product Details
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    Gold / Silver Paste Printer Machine Fully Automatic Semiconductor Printer

    Gold/Silver Paste Fully Automatic Semiconductor Printer


    Adopt screen printing to print conductor paste, resistor paste, or dielectric paste onto ceramic substrates, after high-temperature sintering, these materials will form a firmly adhered film on the ceramic circuit board. After repeated multiple times, a multi-layer interconnected circuit which contains the resistors or capacitors will be formed. Suneast gold paste/silver paste fully automatic semiconductor printer adopts modular design and humanized structure, which can cope with high-precision requirements for film thickness uniformity such as gold paste, conductive silver paste, R glue, and glass base glaze.


    Application:

    Suneast Semiconductor Fully Automatic Screen Printer SEMI-E3 is widely used in the printing process of semiconductor devices, thermal print heads, ceramic capacitors, ceramic circuits, filters, potentiometers, dielectric antennas, RFID, LTCC, MLCC, sensors, piezoelectric ceramic components, chip components and other products.


    Features and advantages:

    ◆ The new appearance design is beautiful, stable and meets the standards of ergonomics and human engineering.

    ◆ For debugging for necessary parameters during the process production, it is equipped with SPI online function, so that the material replacement and printing quality can be truly intelligently controlled.

    ◆ New and advanced UI software interface, with portable and smart software, and the easy-to-understand and easy-to-operate Chinese and English systems make the product easy to use and has no geographical boundaries.

    ◆ The newly upgraded optical path system, in addition to ensuring good MARK recognition capabilities, also meets the traceability requirements required by the current intelligent line.

    ◆ The dust-proof design meets the working requirements of the equipment in a thousand-level cleanliness environment.

    ◆ The newly designed high-precision printing platform provides a guarantee for the consistency of printed film thickness, and the film thickness accuracy can reach ±1 micron.

    ◆ The CCD vision module adopts a linear motor gantry dual-drive structure to provide guarantees for equipment accuracy and stability.

    ◆ The LOT board function enhances the intelligent processing capabilities of the equipment.


    Module introduction:

    Substrate positioning module:

    1. Full servo UVW module with advanced platform calibration algorithm to improve substrate alignment accuracy and stability.

    2. High-precision vacuum adsorption, positioning and support mechanism to perfectly meet the clamping and positioning requirements of thick film printing process.

    3. Provide vacuum negative pressure monitoring and vacuum breaking functions.


    Robot handling module:

    1. Avoid product contamination, effectively reduce the substrate contamination problem caused by powder loss during traditional belt conveyor, and is suitable for operation in a high-cleanliness environment.

    2. The three-stage track conveying mechanism effectively improves product production efficiency.


    CCD vision module:

    1. The CCD vision module adopts a gantry dual-drive motion structure, which can effectively solve the problem of uneven force on both ends of the beam of the traditional transmission mechanism.

    2. Both CCD X-axis and Y-axis are driven by linear motors, which greatly improves the visual positioning accuracy and efficiency.


    Squeegee printing module:

    1. Adjustable screen frame arm with scale to meet the needs of fast fixing of screens of different specifications.

    2. Specially made one-lay one-scrape squeegee, and the squeegee head is adjustable in Y direction to meet the centering adjustment of substrates with different widths.

    3. Adjustable Y-direction positioning mechanism to achieve fast switching of screens;

    4. Innovative long-side printing method reduces squeegee length and improves squeegee force uniformity.


    Squeegee pressure control module:

    1. Multiple pressure control modes (drop control, closed-loop pressure control, normal pressure control, etc.) to meet the pressure setting requirements of the equipment under different processes.

    2. The printing angle adaptive squeegee structure can fit the screen and achieve uniform pressure better.

    3. Real-time pressure monitoring system to achieve closed-loop control of squeegee pressure.


    Cleaning module:

    1. Spray cleaning agent feeding system, which can realize precise control of cleaning agent through the software.

    2. Programmable cleaning mode setting, which can realize intelligent cleaning operation.

    3. The flexible wiping board structure can fit the screen in real time, which can better improve the cleaning effect.


    Automatic paste feeding module:

    1. It can be customized according to the size of the customer's paste tank to prevent poor printing caused by untimely manual paste feeding.

    2. Automatically add paste to reduce labor costs.

    3. Automatically prompt to replace the paste tank.


    parameter:

    Machine Performance
    Repeat Position Accuracy± 8um@6σ,CPK≥2.0
    Repeat Print Accuracy±15um@6σ,CPK≥2.0
    Printing film thickness accuracy±1um
    Printing thinnest thickness5um
    Excluding cleaning and printing7sec
    Processing CT4min
    Line Change CT2min
    Substrate Processing Parameters
    Maximum Laminate Dimension

    Standard 270*70mm

    None-standard can be customized

    Minimum Laminate Dimension

    Standard 270*70mm

    None-standard can be customized

    Laminate Thickness0.5-2mm
    Mechanical Range of Capture560(X)*540(Y)mm
    Maximum Laminate Weight1kg
    Marginal Gap of Laminate0mm
    Height over the Top0mm(can be customized)
    Transmission Height900±40mm
    Transmission Speed(Control by section):1500mm/s(max)
    Way of TransmissionThree-section transmission guide rail and manipulator handing
    Transmission Direction

    standard:From left to right

    From right to left can be customizable

    Laminate Support MethodVacuum platform
    Laminate ClampingFlexible side clamps and Vacuurm suction function
    Printing Parameters
    Printing Speed10-200mm/sec
    Printing Pressure control Method

    0.5~20Kg(pressure control)

    0.01~10mm(position control)

    Printing Mode

    Single scraper printing

    Double scraper printing

    Inking left and printing right

    Inking right and printing left

    Scraper TypeRubber scraper/steel scraper (angle: 45/55/60)
    Stripper Distance0~20mm
    Stripper Speed0-20mm/sec
    Size of Steel Mesh Frame

    470(X)*370(Y)mm~737(X)*737(Y)mm

    (Thickness:20-40mm)

    Positioning Method of Steel MeshManual compensation adjustment
    Cleaning Parameters
    Cleaning MethodDry wiping wet wiping vacuum
    High Speed CleaningIntegral & back and forth cleaning
    Cleaning SystemTop spray type
    Cleaning StrokeGenerated automatically based on the length and width of the laminate
    Cleaning PositionPosting-cleaning
    Cleaning Speed10-200mm/sec
    Consumption of Cleaning FluidGenerated automatically. Manually adjustable
    Consumption of Cleaning PaperGenerated automatically. Manually adjustable
    Image Parameters
    Field of Vision of Image7 mm*5.5 mm
    Camera Typeimported digital camera
    Image Pickup SystemUp-dawn Imaging, stepless adjustment of light source
    Capture CT100ms
    Type of Datum Point

    Datum point of stanclard shapes

    Such as circle, square, rhombus, cross

    Bonding pad and special-shaped

    Mark Size0.1-4 mm
    Number of Marks2 pcs
    Number of Fool. Proof Pointssoftware configurable
    Machine Parameter
    Power RequirementAC:220±10%,50/60Hz 2.2KW
    Requirement of Compressed Air4~6Kgf/cm²
    Gas ConsumptionAbout 5L/min
    Temperature of Working Environment-20°C-+45°C
    Humidity of Working Environment30%~60%
    Machine Height (Excluding tricolor light)1665 mm
    Machine Length X-Direction1140 mm
    Machine Width Y-Direction1155 mm
    Machine WeightAbout 900Kg
    Quality Gold / Silver Paste Printer Machine Fully Automatic Semiconductor Printer for sale
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