Mini Selective Soldering System SUNFLOW FS/450

Selective wave soldering is a special form of wave soldering applied to PCB plug-in through-hole soldering. Selective wave soldering generally consists of three modules: flux spraying, preheating, and soldering. The flux nozzle moves to the command position according to the pre programmed program, and selectively spray the position to be welded. After the PCB is preheated by the upper and lower preheating modules, the welding module performs welding according to the programming path.

Application range:

Selective wave soldering is mainly used in high-end electronic products such as military aerospace, automotive electronics, railway products, switch power supplies, etc. It can meet the through-hole soldering requirements of multi-layer PCBs with high soldering requirements and complex processes.

Features:

• Equip with spraying, preheating and welding units which can complete the whole welding process in a small machine.
• Rotary track design which allows loading and unloading PCB on the same side of the machine.
• Cover small area, shorter than the standard SUNFLOW machine.
• Real time monitoring and recording of welding process.

Overall diagram:

Soldering process

• Send a PCB to the specified location
• PCB selective spraying, preheating and soldering are according to the setup program.
• PCB is transported out

Basic machine module:

• Flux Module
• Preheat Module
• Soldering Module
• Conveyor System

Working Process:After PCB is moved to flux area,the spray head is targeted to the programed position and the flux is applied only to the solder joint to be made. After preheating,the electromagnetic pump moves to the target area and solder joint is made.

Selective soldering system introduction:
Fast and comfortable programing:

• A variety of programming options are available
• Different parameter for every soldering point
• Offline programing
• Process data record

Smooth conveying system:
Conveyor System combines chain and roller transports. Chain transport system is chosen in flux and preheating module. The soldering module use the roller transport which performs good in location board and repeatability
High precision spray system:
The standard machine uses a precision drop nozzle with diameter of 130μm, which can evenly spray the flux to the required soldering area. The minimum spray area is 3mm, saving at least 90% flux compared to conventional spray
Perfect preheating system:
Combine stop heater and bottom heater and it sill performs perfectly even for the lead-free soldering or multi-layer boards. Top convection heater has been proved by Sun East Reflow machine for many years and it can offer an even temperature distribution over the complete
board. Bottom IR emitter heater provides optional heating area according the custom board. At the same time, another top heater covers the soldering module and it can maintain the board temperature in all the cycle time.
Stable and high quality soldering system:

• Electromagnetic solder pump
• Stable wave height
• Quick-change solder nozzles
• Special solder nozzle
• Low maintains required
• Welding process can be recorded

Common options:

1. Automatic tinning

• Support 2mm diameter tin wire.
• Support 1kg to 4kg tin wire coil installation.
• Tin addition frequency and time can be set to meet the requirements of liquid level height.

2. Automatic cleaning

• Powder cleaning method.
• Customize the cleaning location.
• Supports setting of cleaning frequency and cleaning time.
• Solve the nozzle oxidation problem.

3. Fiducial identification and positioning function

• High definition camera configuration.
• Can set multiple image recognition modes.
• The recognition function can be turned on or off separately.
• Can turn on or off the recognition function separately.

Product Parameters:

Notices:
1.Power requirements:
①Three phase five wire: voltage 380V, frequency 50/60HZ;
②The wire diameter requirement is 16mm², with a leakage protection switch of 125A and a leakage capacity of 150-200mA.
2.The ground is required to withstand a pressure of 1000kg/m².
3.External ventilation requirements:
①Spray: Duct specification: Ø150mm exhaust volume 150M³/H;
②Welding: Duct specification: Ø150mm exhaust volume 150M³/H.

Founded in Hong Kong in 1984, Suneast technology established its industrial park in Shenzhen in 1999 and listed on the main board of Hong Kong stock exchange in 2000 (Stock Code: 0365. HK).The independent R&D products, like reflow oven, wave soldering machine, selective soldering machine, vertical oven, printer and etc has always maintained a leading position in technology, and provided professional electronic equipment solutions for many well-known enterprises at home and abroad.

With modern industrial parks and advanced R&D facilities, Suneast technology has strong system integration capabilities in R&D, design, production, automation and information equipment manufacturing. Its sales network is all over the world. Suneast technology has been achieved technical strategic cooperation with Tsinghua University, Chinese University of Hong Kong, Hong Kong University of Science and Technology and Harbin Institute of Technology, and its R&D capabilities has reached the advanced level at home and abroad.

In the core area of Guangdong-Hong Kong-Macao Greater Bay Area, Suneast technology has served semiconductor back-end application customers for more than 40 years, its downstream and end customers include Huawei, ZTE, TCL, Hikvision, MLS LIGHTING, DBG, DESAYSV AUTOMOTIVE, SHENZHEN MTC, JFLED, etc.

The dual drive gantry synchronous follow linear motor technology has been successfully applied to a number of high-speed and high-precision equipment manufacturing and processing fields, and gains great praise by users. The new semiconductor packaging equipment, like chip bonder is the masterpiece of Suneast technology, which helps the development of domestic chip industry. Today, Suneast technology has become the leader of China's intelligent equipment industry.

As the core enterprise of Sino ICT Holdings, Suneast technology will strengthen the strategic goal of the group and become a world-class enterprise in the field of high technology.

Culture

Vision

To be the leader in the global SMT intelligent equipment industry and the champion in the semiconductor equipment sub-industry!

Maintain leading technology level, R&D strength, industrial scale, and management model, and become the leader of the global SMT intelligent equipment industry and the champion of the semiconductor equipment sub-industry!

  Mission