SEMI Series Modular Design Semiconductor Reflow Soldering Oven Hot Air System

Application:

• The solder paste which is printed on the convex metal surface will be refluxed into a ball to complete the combination welding of the tin ball and the substrate
• After the chip is placed to the PCB, the chip and the circuit board are connected together to realize the chip packaging and integrated circuit manufacturing

Core Technology:

01 Hot air system with patent, efficient heat compensation ability, accurate temperature control accuracy

02 With nitrogen protection in the whole process, independent nitrogen control in each temperature zone, to prevent components oxidation during the welding process

03 Low oxygen content control in the furnace which will be within 50-200PPM during the whole process, to ensure good welding quality

04 Modular design, efficient cooling system, cooling slope can reach 0.5-6℃/S, to meet the requirements of each process cooling slope

05 Fine mesh belt for smooth conveying, also for tiny components transmission, prevent falling, to ensure stable product quality

06 Efficient and clean treatment, to meet the requirements of dust-free workshop for semiconductor

Product Features:

CONVEYOR SYSTEM Special fine mesh belt transmission for semiconductor, for tiny components, to prevent falling and jamming
HOT AIR SYSTEM MULTI-FREQUENCY CONTROL Multi-frequency converter control, more precise temperature control, the air flow range can be controlled from low to high, to ensure that the control system is stable and reliable
ROSIN RECOVERY SYSTEM There’re independent rosin recovery devices at the inlet and outlet sides, and also for the preheating area, multistage filtration
FULL NITROGEN PROTECTION SYSTEM, LOW OXYGEN CONTENT The nitrogen is charging in the whole process and controlled Independently in each process section; ultra-low oxygen concentration environment, and the oxygen content in the furnace can be within 50PPM to ensure excellent welding quality
LOW NITROGEN CONSUMPTION Brand new furnace structure design, multi-layer heat insulation, closed-loop control of recovery system, effectively save the amount of nitrogen and save the use cost
EFFICIENT HOT AIR CIRCULATION HEATING SYSTEM Multi-layer heat insulation design, high stability of thermal efficiency, low energy consumption, reduce production costs
COOLING SYSTEM Cooling zone with high power cold water system to ensure optimal cooling slope
CONTROL SYSTEM Super temperature control ability, to meet the packaging heating process profile of semiconductor
HIGH CLEANLINESS Special clean room for R&D, thousand level of cleanliness, to meet the requirements of high cleanliness environment of semiconductor equipment
CONVEYOR SYSTEM The software supports SECS/GEM semiconductor communication protocol, connects the intelligent factory information and control system, which can effectively realizes the functions of connection management, data collection, alarm, control status, equipment terminal service and message log, etc

Product Parameters:

Notices:

1.Power requirements:

①Three phase five wire: voltage 380V, frequency 50/60HZ;

②Wire diameter above 25mm², leakage protection switch 160A, leakage protection switch leakage capacity 150-200mA.

2.The ground is required to withstand a pressure of 1000kg/m²

3.External ventilation requirements: air duct Ø145mm, ventilation volume 15-20M³/min.

Founded in Hong Kong in 1984, Suneast technology established its industrial park in Shenzhen in 1999 and listed on the main board of Hong Kong stock exchange in 2000 (Stock Code: 0365. HK).The independent R&D products, like reflow oven, wave soldering machine, selective soldering machine, vertical oven, printer and etc has always maintained a leading position in technology, and provided professional electronic equipment solutions for many well-known enterprises at home and abroad.

With modern industrial parks and advanced R&D facilities, Suneast technology has strong system integration capabilities in R&D, design, production, automation and information equipment manufacturing. Its sales network is all over the world. Suneast technology has been achieved technical strategic cooperation with Tsinghua University, Chinese University of Hong Kong, Hong Kong University of Science and Technology and Harbin Institute of Technology, and its R&D capabilities has reached the advanced level at home and abroad.

In the core area of Guangdong-Hong Kong-Macao Greater Bay Area, Suneast technology has served semiconductor back-end application customers for more than 40 years, its downstream and end customers include Huawei, ZTE, TCL, Hikvision, MLS LIGHTING, DBG, DESAYSV AUTOMOTIVE, SHENZHEN MTC, JFLED, etc.

The dual drive gantry synchronous follow linear motor technology has been successfully applied to a number of high-speed and high-precision equipment manufacturing and processing fields, and gains great praise by users. The new semiconductor packaging equipment, like chip bonder is the masterpiece of Suneast technology, which helps the development of domestic chip industry. Today, Suneast technology has become the leader of China's intelligent equipment industry.

As the core enterprise of Sino ICT Holdings, Suneast technology will strengthen the strategic goal of the group and become a world-class enterprise in the field of high technology.

Culture

Vision

To be the leader in the global SMT intelligent equipment industry and the champion in the semiconductor equipment sub-industry!

Maintain leading technology level, R&D strength, industrial scale, and management model, and become the leader of the global SMT intelligent equipment industry and the champion of the semiconductor equipment sub-industry!

  Mission