SST-350 Flexible Modular Lead free Wave Soldering Equipment Flux Spraying System

SST series is a fully upgraded wave soldering with enhanced modular, digital and humanized design to meet customer needs, with more perfect function, more advanced performance, further improved stability and reliability, the operation and maintenance is more convenient, and the customer operation cost is reduced more.

Feature:

• Conveyor: Direct buffering input structure. Stainless steel chain conveyor, durable and special design for aluminum alloy track. Adopt segment floating structure to prevent from deformation
• Pre-heating zones: Design for energy saving and removable modules (drawer design). Any combination of infrared and hot air convection. Use PID control to achieve ±2℃ accuracy. The temperature variation for pre-heating zone and soldering zone is less than≤5℃
• Flux spraying system: Managed by digital control. The motion of the spray nozzle is controlled by stepper motor. Flux supply is controlled automatically for optimized effect. Exhausting and filter system installed on the top
• The solder pot is made by cast iron with anti-corrosion ceramic coating equipped with two low flow rate nozzles
• Air cooling system: cooling rate 4-6℃/s (adjustable)
• PC+PLC control system. Windows10 operation system with Chinese/English operation interface. Processing profile and data auto saving function. Alarm for detecting the flux and solder level

Application range:

Wave soldering equipment is used to solder through-hole components and circuit boards through high-temperature liquid solder waves on printed boards with pre installed plug-in components. Wave soldering is widely used in the electronic product manufacturing industry, including consumer electronics, communication equipment, household appliances, power supplies, automotive electronics, medical equipment, industrial automation, energy and other industries

Overall diagram:

01 Buffer system

02 Flux supply system

03 Exhaust fan

04 Flux spray system

05 LCD

06 Pre-heater

07 Dual wave solder pot

08 Solder pot lifting unit

09 Cooling system

10 Angle adjustment controller

11 Finger cleaning system

12 Conveyor system

Built in spraying unit
Top exhausting and filtering System
Forced cooling system
Lead-free processing nozzle
Flexible combination of preheating system
Solder pot is motorized in/out/up/down

Product Parameters:

Modol NO	SST-350
Dimension:LxWxH(mm)	4350×1420×1750
Weigh	Approx.1600kg
Power Supply	3PH 380V 50HZ
Startup Power	33KW
Operation Power Consumption	8KW
Control System	PC+PLC
Spraying movement	Step motor
Spray Pressure	0.2Mpa~0.4Mpa
Flux Flow Arrange	option
Auto Fill Flux	Standards
Exhaust	Top exhaust
Exhaust Ducting Diameter(mm)	Φ250
Exhaust fan power	750W
Preheating Mode	Convection/IR emitter
Control Mode	PID
Preheating Zone Number	3
Preheating Length(mm)	1800
Preheating Temperature	Room temperature~200℃
Warm-up Time(min)	Appro×.12min(setting:150℃)
PCB Width(mm)	50~350
Conveyor Direction	L→R(Option:R→L)
Conveyor Speed(mm/min)	500~1800
Conveyor Height(mm)	750±20
Available Component Heigh (mm)	Top120,Bottom15
Conveyor Speed Control Mode	Closed loop stepless speed regulation Inverter
Fingers	Spring Pressing Finger/D-40Type Finger/Double-hook Finger/Heavy type double hook finger, Options
Conveyor Angle	4~7°
Type of solder Pot	Motor drive
Solder Pot Material	Casting Iron
Wave Height Adjustment	Digital Control by PC
Cooling Method	Air Cooling Option:Water cooing
Heater Power	13.5KW
Solder Pot Temperature	300°℃
Solder Pot Capacity	Approx.480KG
Wave Drive Power	180W*2 3PH 220VAC
Solder Pot Warm-up Time	Approx.150min(setting:250℃)
Temperature Control Mode	PID
Finger Cleaning System	Brush

Notices:

1.Power requirements:

①Three phase five wire: voltage 380V, frequency 50/60HZ;

②The wire diameter requirement is 16mm², with a leakage protection switch of 125A and a leakage capacity of 150-200mA.

2.The ground is required to withstand a pressure of 1000kg/m².

3.External air exhaust requirements:

①Spray: air duct Ø250mm, exhaust air volume 30M³/min;

②The exhaust air volume for the tin furnace outlet Ø250 and the tail cover outlet Ø150 is about 15M³/min.

Founded in Hong Kong in 1984, Suneast technology established its industrial park in Shenzhen in 1999 and listed on the main board of Hong Kong stock exchange in 2000 (Stock Code: 0365. HK).The independent R&D products, like reflow oven, wave soldering machine, selective soldering machine, vertical oven, printer and etc has always maintained a leading position in technology, and provided professional electronic equipment solutions for many well-known enterprises at home and abroad.

With modern industrial parks and advanced R&D facilities, Suneast technology has strong system integration capabilities in R&D, design, production, automation and information equipment manufacturing. Its sales network is all over the world. Suneast technology has been achieved technical strategic cooperation with Tsinghua University, Chinese University of Hong Kong, Hong Kong University of Science and Technology and Harbin Institute of Technology, and its R&D capabilities has reached the advanced level at home and abroad.

In the core area of Guangdong-Hong Kong-Macao Greater Bay Area, Suneast technology has served semiconductor back-end application customers for more than 40 years, its downstream and end customers include Huawei, ZTE, TCL, Hikvision, MLS LIGHTING, DBG, DESAYSV AUTOMOTIVE, SHENZHEN MTC, JFLED, etc.

The dual drive gantry synchronous follow linear motor technology has been successfully applied to a number of high-speed and high-precision equipment manufacturing and processing fields, and gains great praise by users. The new semiconductor packaging equipment, like chip bonder is the masterpiece of Suneast technology, which helps the development of domestic chip industry. Today, Suneast technology has become the leader of China's intelligent equipment industry.

As the core enterprise of Sino ICT Holdings, Suneast technology will strengthen the strategic goal of the group and become a world-class enterprise in the field of high technology.

Culture

Vision

To be the leader in the global SMT intelligent equipment industry and the champion in the semiconductor equipment sub-industry!

Maintain leading technology level, R&D strength, industrial scale, and management model, and become the leader of the global SMT intelligent equipment industry and the champion of the semiconductor equipment sub-industry!

  Mission